JPH0365019B2 - - Google Patents

Info

Publication number
JPH0365019B2
JPH0365019B2 JP60270388A JP27038885A JPH0365019B2 JP H0365019 B2 JPH0365019 B2 JP H0365019B2 JP 60270388 A JP60270388 A JP 60270388A JP 27038885 A JP27038885 A JP 27038885A JP H0365019 B2 JPH0365019 B2 JP H0365019B2
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor device
semiconductor element
sealing ring
threaded portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60270388A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62128548A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP60270388A priority Critical patent/JPS62128548A/ja
Priority to US06/933,389 priority patent/US4829364A/en
Priority to DE19863640801 priority patent/DE3640801A1/de
Publication of JPS62128548A publication Critical patent/JPS62128548A/ja
Publication of JPH0365019B2 publication Critical patent/JPH0365019B2/ja
Priority to US07/987,558 priority patent/USRE34696E/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
JP60270388A 1985-11-29 1985-11-29 半導体装置 Granted JPS62128548A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60270388A JPS62128548A (ja) 1985-11-29 1985-11-29 半導体装置
US06/933,389 US4829364A (en) 1985-11-29 1986-11-21 Semiconductor device
DE19863640801 DE3640801A1 (de) 1985-11-29 1986-11-28 Halbleiterbauelement
US07/987,558 USRE34696E (en) 1985-11-29 1992-12-08 Semiconductor device housing with electrodes in press contact with the opposite sides of chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60270388A JPS62128548A (ja) 1985-11-29 1985-11-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS62128548A JPS62128548A (ja) 1987-06-10
JPH0365019B2 true JPH0365019B2 (en]) 1991-10-09

Family

ID=17485564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60270388A Granted JPS62128548A (ja) 1985-11-29 1985-11-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS62128548A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009034138B4 (de) * 2009-07-22 2011-06-01 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
JPS62128548A (ja) 1987-06-10

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